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Ultrasound Variable-Gain Amplifier
Applications Information
External Compensation
External compensation is required for bypassing inter-
nal biasing circuitry. Connect, as close as possible,
individual 4.7μF capacitors from each pin EXT_C1,
EXT_C2, and EXT_C3 (pin 13, 14, 15) to ground.
External Bias Resistor
An external resistor at EXT_RES is required to set the
bias for the internal biasing circuitry. Connect, as close
as possible, a 7.5k Ω resistor from EXT_RES (pin 38) to
ground.
Analog Input and Output Coupling
In typical applications, the MAX2035 is being driven
from a low-noise amplifier (such as the MAX2034) and
is typically driving a discrete differential anti-alias filter
into an ADC (such as the MAX1434 octal ADC). The
differential input impedance of the MAX2035 is typically
200 Ω . The differential outputs are capable of driving a
differential load resistance of 1k Ω . The output imped-
ance is 100 Ω differential. The differential outputs have
a common-mode bias of approximately 3V. AC-couple
these differential outputs if the next stage has a differ-
ent common-mode input range.
Ultrasound-Specific IMD3 Specification
Unlike typical communications specs, the two input
tones are not equal in magnitude for the ultrasound-
specific IMD3 two-tone specification. In this measure-
ment, f 1 represents reflections from tissue and f 2
represents reflections from blood. The latter reflections
are typically 25dB lower in magnitude, and hence the
PCB Layout
The pin configuration of the MAX2035 is optimized to
facilitate a very compact physical layout of the device
and its associated discrete components. A typical
application for this device might incorporate several
devices in close proximity to handle multiple channels
of signal processing.
The exposed pad (EP) of the MAX2035 ’s TQFP-EP
package provides a low thermal-resistance path to the
die. It is important that the PCB on which the MAX2035
is mounted be designed to conduct heat from the EP.
In addition, provide the EP with a low-inductance path
to electrical ground. The EP MUST be soldered to a
ground plane on the PCB, either directly or through an
array of plated via holes.
-25dB
ULTRASOUND
IMD3
measurement is defined with one input tone 25dB lower
f 1 - (f 2 - f 1 )
f 1
f 2
f 2 + (f 2 - f 1 )
than the other. The IMD3 product of interest (f 1 - (f 2 - f 1 ))
presents itself as an undesired Doppler error signal in
ultrasound applications. See Figure 1.
Figure 1. Ultrasound IMD3 Measurement Technique
10
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